4N25-000E View Datasheet(PDF) - Avago Technologies
Part Name
Description
Manufacturer
4N25-000E Datasheet PDF : 7 Pages
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Solder Reflow Temperature Profile
1. One-time soldering reflow is recommended within
the condition of temperature and time profile shown
at right.
2. When using another soldering method such as infrared
ray lamp, the temperature may rise partially in the mold
of the device. Keep the temperature on the package
of the device within the condition of (1) above.
150°C
250°C
217°C
200°C
30 seconds
260°C (Peak Temperature)
60 sec
25°C
60 ~ 150 sec
90 sec
Time (sec)
Note: Non-halide flux should be used.
60 sec
Absolute Maximum Ratings
Storage Temperature, TS
Operating Temperature, TA
Lead Solder Temperature, max.
(1.6 mm below seating plane)
Average Forward Current, IF
Reverse Input Voltage, VR
Input Power Dissipation, PI
Collector Current, IC
Collector-Emitter Voltage, VCEO
Emitter-Collector Voltage, VECO
Collector-Base Voltage, VCBO
Collector Power Dissipation
Total Power Dissipation
Isolation Voltage, Viso
(AC for 1 minute, R.H. = 40 ~ 60%)
–55˚C to +150˚C
–55˚C to +100˚C
260˚C for 10 s
80 mA
6V
150 mW
100 mA
30 V
7V
70 V
150 mW
250 mW
2500 Vrms
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