BA2904FVM View Datasheet(PDF) - ROHM Semiconductor
Part Name
Description
Manufacturer
BA2904FVM Datasheet PDF : 55 Pages
| |||
BA10358xx, BA10324Axx, BA2904xxx, BA2904Sxxx, BA2904Wxx
BA2902xx, BA2902Sxx
Datasheet
Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 102 (a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation
(PD).
θJA = (TJmax－TA) / PD °C/W
The derating curve in Figure 102 (b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 102. (c) to (f) show a derating curve for an example of BA10358,
BA10324A, BA2904S, BA2904, BA2904W, BA2902S, BA2902.
LPSoIwのe消r D費iss電ipa力tio[nWo]f LSI [W]
PPDd(m(amx)ax)
θJA=(TJmax-TA)/ PD °C/W
P2
θθJjaA22 << θθJjaA11
Ambient Temperature TA [ °C ]
P1
θθ’'JAja22 θθJjAa22
θθ’J'Aj1a1 θθJjaA11
TjJ’'m(amx axT) JmTajx(max)
Chip Surface Temperature TJ [ °C ]
(a) Thermal Resistance
1000
800
600
400
BA10358F(Note 30)
BA10358FJ(Note 31)
BA10358FV(Note 32)
0
25
50
75
100 125 150
Ambie周nt囲Te温m度perTaatu[℃re]TA[C]
(b) Derating Curve
1000
800
BA10324AFJ(Note 33)
600
BA10324AFV V(Note 34)
BA10324AF(Note 35)
400
200
200
0
0
1000
800
600
400
25
50
75
100
125
AMBIEN T TEMPERATURE [℃] .
(c)BA10358
BA2904F(Note 36)
BA2904WF(Note 36)
BA2904SF(Note 36)
BA2904FV(Note 37)
BA2904WFV(Note 37)
BA2904SFV(Note 37)
BA2904FVM(Note 38)
BA2904SFVM(Note 38)
0
0
1000
800
25
50
75
100
125
AMBIENT TEMPERAT URE [℃ ] .
(d)BA10324
BA2902FV(Note 39)
BA2902SFV(Note 39)
600
400
BA2902F((Note 40)
BA2902SF(Note 40)
200
200
0
0
25
50
75 100 125 150
AMBIENT TEMPERATURE [℃ ] .
(e)BA2904
0
0
25
50
75 100 125 150
AMBIENT TEMPERAT URE [℃ ] .
(f)BA2902
(Note 30) (Note 31) (Note 32) (Note 33) (Note 34) (Note 35) (Note 36) (Note 37) (Note 38) (Note 39) (Note 40) Unit
6.2
5.4
5.0
8.2
7.0
4.5
6.2
5.0
4.7
7.0
4.5 mW/°C
When using the unit above TA=25°C, subtract the value above per degree °C.
Permissible dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (copper foil area below 3%) is mounted.
Figure 102. Thermal resistance and derating
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
40/52
TSZ02201-0RAR0G200130-1-2
23.Jan.2014 Rev.003
|
|
Share Link: 