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X006 데이터 시트보기 (PDF) - STMicroelectronics

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X006 0.8 A sensitive gate SCRs ST-Microelectronics
STMicroelectronics ST-Microelectronics
X006 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
X006
3
Package information
Package information
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Table 4.
BC
TO-92 (plastic) dimensions
Dimensions
Ref.
Millimeters
Inches
A
F
D
E
Min. Typ. Max. Min. Typ. Max.
a
A
B
1.35
4.70
0.053
0.185
C
2.54
0.100
D 4.40
0.173
E 12.70
0.500
F
3.70
0.146
a
0.50
0.019
Table 5. SOT-223 dimensions
Dimensions
Ref.
Millimeters
Inches
A
A1
V
B
e1
D
B1
HE
4
1
2
3
e
c
Min. Typ. Max. Min. Typ. Max.
A
1.80
0.071
A1
0.02 0.10
0.001 0.004
B 0.60 0.70 0.85 0.024 0.027 0.033
B1 2.90 3.00 3.15 0.114 0.118 0.124
c 0.24 0.26 0.35 0.009 0.010 0.014
D(1) 6.30 6.50 6.70 0.248 0.256 0.264
e
2.3
0.090
e1
4.6
0.181
E(1) 3.30 3.50 3.70 0.130 0.138 0.146
H 6.70 7.00 7.30 0.264 0.276 0.287
V
10° max
1. Do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm (0.006inches)
7/9
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