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X00602MA View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
X00602MA
ST-Microelectronics
STMicroelectronics ST-Microelectronics
X00602MA Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
X006
Characteristics
Table 3.
Symbol
Thermal resistances
Rth(j-a) Junction to ambient (DC)
Rth(j-l)
Rth(j-t)
Junction to lead (DC)
Junction to tab (DC)
Parameter
S = 5 cm2
TO-92
SOT-223
TO-92
SOT-223
Value
150
60
70
30
Unit
°C/W
Figure 1.
Maximum average power
Figure 2.
dissipation versus average on-state
current
Average and DC on-state current
versus case temperature (TO-92)
P(W)
0.6
α = 180°
0.5
0.4
0.3
0.2
0.1
0.0
0.0
0.1
IT(AV)(A)
0.2
0.3
0.4
360°
α
0.5
0.6
IT(AV)(A)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
25
D.C.
α = 180°
TO-92
Tl(°C)
50
75
100
125
Figure 3.
Average and D.C. on-state current Figure 4.
versus ambient temperature (epoxy
printed circuit board FR4, copper
thickness = 35 µm, SCU = 0.5 cm2)
(TO-92)
Average and DC on-state current
versus case temperature (SOT-223)
IT(AV)(A)
1.0
0.9
D.C.
0.8
0.7
0.6
α = 180°
0.5
0.4
0.3
0.2
0.1
0.0
0
25
Tamb(°C)
50
75
TO-92
SCU = 0.5 cm2
100
125
IT(AV)(A)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
25
D.C.
α = 180°
SOT-223
Ttab(°C)
50
75
100
125
3/9
 

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