Q16DWUUIG View Datasheet(PDF) - Winbond

Part Name

Description

Manufacturer

Q16DWUUIG

1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

Winbond 

W25Q16DW

7.2.40

7.2.41

7.2.42

Enable QPI (38h) ................................................................................................................66

Disable QPI (FFh)...............................................................................................................67

Enable Reset (66h) and Reset (99h) ..................................................................................68

8. ELECTRICAL CHARACTERISTICS .............................................................................................. 69

8.1 Absolute Maximum Ratings (1) .......................................................................................... 69

8.2 Operating Ranges .............................................................................................................. 69

8.3 Power-Up Power-Down Timing and Requirements ........................................................... 70

8.4 DC Electrical Characteristics.............................................................................................. 71

8.5 AC Measurement Conditions ............................................................................................. 72

8.6 AC Electrical Characteristics .............................................................................................. 73

8.7 AC Electrical Characteristics (cont’d) ................................................................................. 74

8.8 Serial Output Timing........................................................................................................... 75

8.9 Serial Input Timing.............................................................................................................. 75

8.10 /HOLD Timing ..................................................................................................................... 75

8.11 /WP Timing ......................................................................................................................... 75

9. PACKAGE SPECIFICATION .......................................................................................................... 76

9.1 8-Pin SOIC 150-mil (Package Code SN) ........................................................................... 76

9.2 8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 77

9.3 8-Pad WSON 6x5-mm (Package Code ZP)....................................................................... 78

9.4 8-Ball WLCSP (Package Code BY) ................................................................................... 79

9.5 8-Pad USON 4x3-mm (Package Code UU) ....................................................................... 80

9.6 16-Pin SOIC 300-mil (Package Code SF).......................................................................... 81

10. ORDERING INFORMATION .......................................................................................................... 82

10.1 Valid Part Numbers and Top Side Marking ........................................................................ 83

11. REVISION HISTORY...................................................................................................................... 84

-4-

Share Link: