25Q16DWIG(2012) View Datasheet(PDF) - Winbond

Part Name

Description

Manufacturer

25Q16DWIG
(Rev.:2012)

1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

Winbond 

W25Q16DW

7.1.11 W25Q16DW Status Register Memory Protection (CMP = 0) .............................................17

7.1.12 W25Q16DW Status Register Memory Protection (CMP = 1) .............................................18

7.2 INSTRUCTIONS................................................................................................................. 19

7.2.1 Manufacturer and Device Identification ................................................................................19

7.2.2 Instruction Set Table 1 (Standard SPI Instructions) .............................................................20

7.2.3 Instruction Set Table 2 (Dual SPI Instructions).....................................................................21

7.2.4 Instruction Set Table 3 (Quad SPI Instructions) ...................................................................21

7.2.5 Instruction Set Table 4 (QPI Instructions).............................................................................22

7.2.6 Write Enable (06h) ...............................................................................................................24

7.2.7 Write Enable for Volatile Status Register (50h)....................................................................24

7.2.8 Write Disable (04h)...............................................................................................................24

7.2.9 Read Status Register-1 (05h) and Read Status Register-2 (35h) ........................................25

7.2.10 Write Status Register (01h) ................................................................................................26

7.2.11 Read Data (03h) .................................................................................................................28

7.2.12 Fast Read (0Bh) .................................................................................................................29

7.2.13 Fast Read Dual Output (3Bh) .............................................................................................31

7.2.14 Fast Read Quad Output (6Bh)............................................................................................32

7.2.15 Fast Read Dual I/O (BBh)...................................................................................................33

7.2.16 Fast Read Quad I/O (EBh) .................................................................................................35

7.2.17 Word Read Quad I/O (E7h) ................................................................................................38

7.2.18 Octal Word Read Quad I/O (E3h).......................................................................................40

7.2.19 Set Burst with Wrap (77h) ..................................................................................................42

7.2.20 Page Program (02h) ...........................................................................................................43

7.2.21 Quad Input Page Program (32h) ........................................................................................45

7.2.22 Sector Erase (20h) .............................................................................................................46

7.2.23 32KB Block Erase (52h) .....................................................................................................47

7.2.24 64KB Block Erase (D8h).....................................................................................................48

7.2.25 Chip Erase (C7h / 60h).......................................................................................................49

7.2.26 Erase / Program Suspend (75h).........................................................................................50

7.2.27 Erase / Program Resume (7Ah) .........................................................................................52

7.2.28 Power-down (B9h) ..............................................................................................................53

7.2.29 Release Power-down / Device ID (ABh) .............................................................................54

7.2.30 Read Manufacturer / Device ID (90h) .................................................................................56

7.2.31 Read Manufacturer / Device ID Dual I/O (92h) ...................................................................57

7.2.32 Read Manufacturer / Device ID Quad I/O (94h) .................................................................58

7.2.33 Read Unique ID Number (4Bh)...........................................................................................59

7.2.34 Read JEDEC ID (9Fh) ........................................................................................................60

7.2.35 Erase Security Registers (44h)...........................................................................................61

7.2.36 Program Security Registers (42h) ......................................................................................62

7.2.37 Read Security Registers (48h) ...........................................................................................63

7.2.38 Set Read Parameters (C0h) ...............................................................................................64

7.2.39 Burst Read with Wrap (0Ch)...............................................................................................65

7.2.40 Enable QPI (38h)................................................................................................................66

Publication Release Date: September 06, 2012

-3-

Revision F

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