25Q16DWIG(2011) View Datasheet(PDF) - Winbond
Part Name
Description
Manufacturer
25Q16DWIG Datasheet PDF : 83 Pages
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W25Q16DW
3. PIN CONFIGURATION SOIC 150 / 208-MIL
/CS
DO (IO1)
/WP (IO2)
GND
1
8
2
7
3
6
4
5
VCC
/HOLD (IO3)
CLK
DI (IO0)
Figure 1a. W25Q16DW Pin Assignments, 8-pin SOIC 150 / 208-mil (Package Code SN & SS)
4. PAD CONFIGURATION WSON 6X5-MM
/CS
1
DO (IO1)
2
/WP (IO2)
3
GND
4
8
VCC
7
/HOLD (IO3)
6
CLK
5
DI (IO0)
Figure 1b. W25Q16DW Pad Assignments, 8-pad WSON 6x5-mm (Package Code ZP)
5. PIN DESCRIPTION SOIC 150/208-MIL, WSON 6X5-MM
PIN NO.
1
2
3
4
5
6
7
8
PIN NAME
/CS
DO (IO1)
/WP (IO2)
GND
DI (IO0)
CLK
/HOLD (IO3)
VCC
I/O
FUNCTION
I
Chip Select Input
I/O
Data Output (Data Input Output 1)*1
I/O
Write Protect Input ( Data Input Output 2)*2
Ground
I/O
Data Input (Data Input Output 0)*1
I
Serial Clock Input
I/O
Hold Input (Data Input Output 3)*2
Power Supply
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI/QPI instructions
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