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W25X10L View Datasheet(PDF) - Winbond

Part Name
Description
Manufacturer
W25X10L Datasheet PDF : 46 Pages
First Prev 31 32 33 34 35 36 37 38 39 40 Next Last
W25X10L, W25X20L, W25X40L, W25X80L
11.2 8-Pin SOIC 208-mil (Package Code SS)
SYMBOL
A
A1
A2
b
C
D
E
E1
e
L
θ
y
MILLIMETERS
MIN
MAX
1.75
2.16
0.05
0.25
1.70
1.91
0.35
0.48
0.19
0.25
5.18
5.38
7.70
8.10
5.18
5.38
1.27 BSC
0.50
0.80
0o
8o
---
0.10
INCHES
MIN
MAX
0.069 0.085
0.002 0.010
0.067 0.075
0.014 0.019
0.007 0.010
0.204 0.212
0.303 0.319
0.204 0.212
0.050 BSC
0.020 0.031
0o
8o
---
0.004
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
- 39 -
Publication Release Date: February 27, 2008
Revision I
 

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