25X10BLIG View Datasheet(PDF) - Winbond
Part Name
Description
Manufacturer
25X10BLIG Datasheet PDF : 53 Pages
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W25X10BL/20BL/40BL
10.7 AC Electrical Characteristics (cont’d)
DESCRIPTION
SYMBOL ALT
MIN
SPEC
TYP
MAX
UNIT
/HOLD Active Setup Time relative to CLK
tHLCH
5
ns
/HOLD Active Hold Time relative to CLK
tCHHH
5
ns
/HOLD Not Active Setup Time relative to CLK
tHHCH
5
ns
/HOLD Not Active Hold Time relative to CLK
tCHHL
5
ns
/HOLD to Output Low-Z
tHHQX(2)
tLZ
7
ns
/HOLD to Output High-Z
tHLQZ(2)
tHZ
12
ns
Write Protect Setup Time Before /CS Low
tWHSL(3)
20
ns
Write Protect Hold Time After /CS High
tSHWL(3)
100
ns
/CS High to Power-down Mode
tDP(2)
3
µs
/CS High to Standby Mode without Electronic
Signature Read
tRES1(2)
3
µs
/CS High to Standby Mode with Electronic
Signature Read
tRES2(2)
1.8
µs
Write Status Register Time
tW
10
15
ms
Byte Program Time (First Byte) (4)
t BP1
Additional Byte Program Time (After First Byte) (4)
t BP2
Page Program Time
tPP
30
50
µs
2.5
12
µs
0.7
3
ms
Sector Erase Time (4KB)
tSE
30
200
ms
Block Erase Time (32KB)
tBE 1
Block Erase Time (64KB)
tBE 2
Chip Erase Time W25X10BL / W25X20BL
tCE
Chip Erase Time W25X40BL
120
800
ms
150 1,000 ms
0.5
2
s
1
4
Notes:
1.
2.
3.
4.
Clock high + Clock low must be less than or equal to 1/fC.
Value guaranteed by design and/or characterization, not 100% tested in production.
Only applicable as a constraint for a Write Status Register instruction when SRP is set to 1.
For multiple bytes after first byte within a page, tBPN = tBP1 + tBP2 * N (typical) and tBPN = tBP1 + tBP2 * N (max),
where N = number of bytes programmed.
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