25X10BLIG View Datasheet(PDF) - Winbond

Part Name

Description

Manufacturer

25X10BLIG

1M-BIT, 2M-BIT AND 4M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI

Winbond 

W25X10BL/20BL/40BL

9.2 INSTRUCTIONS

The instruction set of the W25X10BL/20BL/40BL consists of nineteen basic instructions that are fully

controlled through the SPI bus (see Instruction Set table). Instructions are initiated with the falling edge

of Chip Select (/CS). The first byte of data clocked into the DIO input provides the instruction code.

Data on the DIO input is sampled on the rising edge of clock with most significant bit (MSB) first.

Instructions vary in length from a single byte to several bytes and may be followed by address bytes,

data bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed

with the rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in

figures 4 through 25. All read instructions can be completed after any clocked bit. However, all

instructions that Write, Program or Erase must complete on a byte boundary (CS driven high after a full

8-bits have been clocked) otherwise the instruction will be terminated. This feature further protects the

device from inadvertent writes. Additionally, while the memory is being programmed or erased, or when

the Status Register is being written, all instructions except for Read Status Register will be ignored until

the program or erase cycle has completed.

9.2.1 Manufacturer and Device Identification

MANUFACTURER ID

(M7-M0)

Winbond Serial Flash

EFh

Device ID

Instruction

W25X10BL

W25X20BL

W25X40BL

(ID7-ID0)

ABh, 90h, 92h

10h

11h

12h

(ID15-ID0)

9Fh

3011h

3012h

3013h

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