25X16BVAIG View Datasheet(PDF) - Winbond

Part Name

Description

Manufacturer

25X16BVAIG

16M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

Winbond 

W25X16BV

11.2.16 Release Power-down / Device ID (ABh)

The Release from Power-down / Device ID instruction is a multi-purpose instruction. It can be used to

release the device from the power-down state, obtain the devices electronic identification (ID) number

or do both.

When used only to release the device from the power-down state, the instruction is issued by driving

the /CS pin low, shifting the instruction code “ABh” and driving /CS high as shown in figure 17. After

the time duration of tRES1 (See AC Characteristics) the device will resume normal operation and other

instructions will be accepted. The /CS pin must remain high during the tRES1 time duration.

When used only to obtain the Device ID while not in the power-down state, the instruction is initiated

by driving the /CS pin low and shifting the instruction code “ABh” followed by 3-dummy bytes. The

Device ID bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first as

shown in figure 17. The Device ID values for the W25X16BV are listed in Manufacturer and Device

Identification table. The Device ID can be read continuously. The instruction is completed by driving

/CS high.

When used to release the device from the power-down state and obtain the Device ID, the instruction

is the same as previously described, and shown in figure 18, except that after /CS is driven high it

must remain high for a time duration of tRES2 (See AC Characteristics). After this time duration the

device will resume normal operation and other instructions will be accepted.

If the Release from Power-down / Device ID instruction is issued while an Erase, Program or Write

cycle is in process (when BUSY equals 1) the instruction is ignored and will not have any effects on

the current cycle

Figure 17. Release Power-down Instruction Sequence

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