W25Q128FVTIQTR View Datasheet(PDF) - Winbond
Part Name
Description
Manufacturer
W25Q128FVTIQTR Datasheet PDF : 97 Pages
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W25Q128FV
3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array)
Top View
Top View
A2
A3
A4
A5
NC
NC
NC
NC
B1
B2
B3
B4
B5
NC
CLK
GND
VCC
NC
C1
C2
C3
C4
C5
NC
/CS
NC /WP (IO2) NC
D1
D2
D3
D4
D5
NC
DO(IO1)
DI(IO0)
/HOLD(IO3)
/RESET
NC
E1
E2
E3
E4
E5
NC
NC
NC
NC
NC
A1
A2
A3
A4
NC
NC
NC
NC
B1
B2
B3
B4
NC
CLK
GND
VCC
C1
C2
C3
C4
NC
/CS
NC /WP (IO2)
D1
D2
D3
D4
NC
DO(IO1)
DI(IO0)
/HOLD(IO3)
/RESET
E1
E2
E3
E4
NC
NC
NC
NC
F1
F2
F3
F4
NC
NC
NC
NC
Package Code B
Package Code C
Figure 1d. W25Q128FV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code B & C)
3.7 Ball Description TFBGA 8x6-mm
BALL
NO.
PIN NAME
I/O
FUNCTION
B2
CLK
I
Serial Clock Input
B3
GND
Ground
B4
VCC
Power Supply
C2
/CS
I
Chip Select Input
C4
/WP (IO2)
I/O
Write Protect Input (Data Input Output 2)(2)
D2
DO (IO1)
I/O
Data Output (Data Input Output 1)(1)
D3
DI (IO0)
I/O
Data Input (Data Input Output 0)(1)
/HOLD or
D4
/RESET
I/O
Hold or Reset Input (Data Input Output 3)(2)
(IO3)
Multiple
NC
No Connect
Notes:
1. IO0 and IO1 are used for Standard and Dual SPI instructions
2. IO0 – IO3 are used for Quad SPI instructions, /WP & /HOLD (or /RESET) functions are only available for Standard/Dual SPI.
Publication Release Date: October 09, 2013
-8-
Revision I
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