W25Q128FVBIQ View Datasheet(PDF) - Winbond

Part Name

Description

Manufacturer

W25Q128FVBIQ

3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

Winbond 

W25Q128FV

10.3 8-Pin PDIP 300-mil (Package Code A)........................................................................................... 90

10.4 8-Pad WSON 6x5-mm (Package Code P) ..................................................................................... 91

10.5 8-Pad WSON 8x6-mm (Package Code E) ..................................................................................... 92

10.6 16-Pin SOIC 300-mil (Package Code F) ........................................................................................ 93

10.7 24-Ball TFBGA 8x6-mm (Package Code B, 5x5-1 ball array) ........................................................ 94

10.8 24-Ball TFBGA 8x6-mm (Package Code C, 6x4 ball array) ........................................................... 95

11. ORDERING INFORMATION .......................................................................................................... 96

11.1 Valid Part Numbers and Top Side Marking .................................................................................... 97

12. REVISION HISTORY...................................................................................................................... 98

Publication Release Date: October 09, 2013

-4-

Revision I

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