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W25Q128FVCIGTR View Datasheet(PDF) - Winbond

Part Name
Description
Manufacturer
W25Q128FVCIGTR Datasheet PDF : 97 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
W25Q128FV
Table of Contents
1. GENERAL DESCRIPTIONS ..................................................................................................................... 5
2. FEATURES ............................................................................................................................................... 5
3. PACKAGE TYPES AND PIN CONFIGURATIONS ................................................................................... 6
3.1 Pin Configuration SOIC / VSOP 208-mil .......................................................................................... 6
3.2 Pad Configuration WSON 6x5-mm / 8x6-mm................................................................................... 6
3.3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm .................................................. 6
3.4 Pin Configuration SOIC 300-mil ....................................................................................................... 7
3.5 Pin Description SOIC 300-mil ........................................................................................................... 7
3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ............................................................. 8
3.7 Ball Description TFBGA 8x6-mm...................................................................................................... 8
3.8 Pin Configuration PDIP 300-mil ........................................................................................................ 9
3.9 Pin Description PDIP 300-mil ........................................................................................................... 9
4. PIN DESCRIPTIONS............................................................................................................................... 10
4.1 Chip Select (/CS) ............................................................................................................................ 10
4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .............................................. 10
4.3 Write Protect (/WP) ......................................................................................................................... 10
4.4 HOLD (/HOLD) ............................................................................................................................... 10
4.5 Serial Clock (CLK) .......................................................................................................................... 10
4.6 Reset (/RESET) .............................................................................................................................. 10
5. BLOCK DIAGRAM................................................................................................................................... 11
6. FUNCTIONAL DESCRIPTIONS ............................................................................................................. 12
6.1
6.1.1
6.1.2
6.1.3
6.1.4
6.1.5
6.1.6
SPI / QPI Operations ...................................................................................................................... 12
Standard SPI Instructions ...............................................................................................................................12
Dual SPI Instructions ......................................................................................................................................12
Quad SPI Instructions.....................................................................................................................................13
QPI Instructions ..............................................................................................................................................13
Hold Function .................................................................................................................................................13
Software Reset & Hardware /RESET pin........................................................................................................15
6.2 Write Protection .............................................................................................................................. 16
6.2.1 Write Protect Features....................................................................................................................................16
7. STATUS AND CONFIGURATION REGISTERS .................................................................................... 17
7.1
7.1.1
7.1.2
7.1.3
Status Registers ............................................................................................................................. 17
Erase/Write In Progress (BUSY) Status Only ..............................................................................................17
Write Enable Latch (WEL) Status Only........................................................................................................17
Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable..............................................................17
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