W25Q128FVFIF(2012) View Datasheet(PDF) - Winbond

Part Name

Description

Manufacturer

W25Q128FVFIF
(Rev.:2012)

3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

Winbond 

W25Q128FV

10.4 8-Pad WSON 6x5-mm (Package Code P) ......................................................................... 89

10.5 8-Pad WSON 8x6-mm (Package Code E) ......................................................................... 90

10.6 16-Pin SOIC 300-mil (Package Code F) ............................................................................ 91

10.7 24-Ball TFBGA 8x6-mm (Package Code B, 5x5-1 ball array) ............................................ 92

10.8 24-Ball TFBGA 8x6-mm (Package Code C, 6x4 ball array) ............................................... 93

11. ORDERING INFORMATION .......................................................................................................... 94

11.1 Valid Part Numbers and Top Side Marking ........................................................................ 95

12. REVISION HISTORY...................................................................................................................... 96

Publication Release Date: October 01, 2012

-4-

Revision D

Share Link: