W25Q16CVTCAP View Datasheet(PDF) - Winbond
Part Name
Description
Manufacturer
W25Q16CVTCAP Datasheet PDF : 79 Pages
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W25Q16CV
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q16CV is offered in an 8-pin SOIC 150-mil or 208-mil (package code SN & SS), an 8-pad WSON
6x5-mm (package code ZP), an 8-pin PDIP 300-mil (package code DA), a 16-pin SOIC 300-mil (package
code SF) and a 24-ball 8x6-mm TFBGA (package code TC) as shown in Figure 1a-e respectively.
Package diagrams and dimensions are illustrated at the end of this datasheet.
3.1 Pin Configuration SOIC 150 / 208-mil
Top View
/CS
1
8
DO (IO1)
/WP (IO2)
GND
2
7
3
6
4
5
VCC
/HOLD (IO3)
CLK
DI (IO0)
Figure 1a. W25Q16CV Pin Assignments, 8-pin SOIC 150 / 208-mil (Package Code SN & SS)
3.2 Pad Configuration WSON 6x5-mm
Top View
/CS
18
VCC
DO (IO1)
/WP (IO2)
GND
27
36
45
/HOLD (IO3)
CLK
DI (IO0)
Figure 1b. W25Q16CV Pad Assignments, 8-pad WSON 6x5-mm (Package Code ZP)
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