W25Q16CVSNAG View Datasheet(PDF) - Winbond

Part Name

Description

Manufacturer

W25Q16CVSNAG

3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

Winbond 

W25Q16CV

7.2.38 Program Security Registers (42h) ......................................................................................61

7.2.39 Read Security Registers (48h) ...........................................................................................62

8. ELECTRICAL CHARACTERISTICS............................................................................................... 63

8.1 Absolute Maximum Ratings................................................................................................ 63

8.2 Operating Ranges............................................................................................................... 63

8.3 Power-up Timing and Write Inhibit Threshold .................................................................... 64

8.4 DC Electrical Characteristics .............................................................................................. 65

8.5 AC Measurement Conditions.............................................................................................. 66

8.6 AC Electrical Characteristics .............................................................................................. 67

8.7 AC Electrical Characteristics (cont’d) ................................................................................. 68

8.8 Serial Output Timing........................................................................................................... 69

8.9 Serial Input Timing.............................................................................................................. 69

8.10 /HOLD Timing..................................................................................................................... 69

8.11 /WP Timing......................................................................................................................... 69

9. PACKAGE SPECIFICATION .......................................................................................................... 70

9.1 8-Pin SOIC 150-mil (Package Code SN)............................................................................ 70

9.2 8-Pin SOIC 208-mil (Package Code SS)............................................................................ 71

9.3 8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 72

9.4 8-Pad WSON 6x5mm (Package Code ZP) ........................................................................ 73

9.5 16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 75

9.6 24-Ball TFBGA 8x6-mm (Package Code TC) .................................................................... 76

10. ORDERING INFORMATION .......................................................................................................... 77

10.1 Valid Part Numbers and Top Side Marking ........................................................................ 78

11. REVISION HISTORY...................................................................................................................... 79

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