W25Q32 View Datasheet(PDF) - Winbond
Part Name
Description
Manufacturer
W25Q32 Datasheet PDF : 61 Pages
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W25Q80, W25Q16, W25Q32
Table of Contents
1. GENERAL DESCRIPTION ......................................................................................................... 5
2. FEATURES ................................................................................................................................. 5
3.
PIN CONFIGURATION SOIC 208-MIL....................................................................................... 6
4.
PAD CONFIGURATION WSON 6X5-MM .................................................................................. 6
5. PIN DESCRIPTION SOIC 208-MIL, AND WSON 6X5-MM........................................................ 6
6.
PIN CONFIGURATION SOIC 300-MIL....................................................................................... 7
7. PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7
7.1 Package Types ............................................................................................................... 8
7.2 Chip Select (/CS) ............................................................................................................ 8
7.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .............................. 8
7.4 Write Protect (/WP)......................................................................................................... 8
7.5 HOLD (/HOLD) ............................................................................................................... 8
7.6 Serial Clock (CLK) .......................................................................................................... 8
8. BLOCK DIAGRAM ...................................................................................................................... 9
9. FUNCTIONAL DESCRIPTION ................................................................................................. 10
9.1 SPI OPERATIONS ....................................................................................................... 10
9.1.1 Standard SPI Instructions...............................................................................................10
9.1.2 Dual SPI Instructions ......................................................................................................10
9.1.3 Quad SPI Instructions.....................................................................................................10
9.1.4 Hold Function .................................................................................................................10
9.2 WRITE PROTECTION.................................................................................................. 11
9.2.1 Write Protect Features....................................................................................................11
10. CONTROL AND STATUS REGISTERS................................................................................... 12
10.1
STATUS REGISTER .................................................................................................... 12
10.1.1 BUSY............................................................................................................................12
10.1.2 Write Enable Latch (WEL) ............................................................................................12
10.1.3 Block Protect Bits (BP2, BP1, BP0)..............................................................................12
10.1.4 Top/Bottom Block Protect (TB).....................................................................................12
10.1.5 Sector/Block Protect (SEC) ..........................................................................................12
10.1.6 Status Register Protect (SRP1, SRP0).........................................................................13
10.1.7 Quad Enable (QE) ........................................................................................................13
10.1.8 Status Register Memory Protection ..............................................................................15
10.2
INSTRUCTIONS........................................................................................................... 18
10.2.1 Manufacturer and Device Identification ........................................................................18
10.2.2 Instruction Set Table 1..................................................................................................19
10.2.3 Instruction Set Table 2 (Read Instructions) ..................................................................20
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