W25P20-VSNI View Datasheet(PDF) - Winbond

Part Name

Description

Manufacturer

W25P20-VSNI

1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 40MHZ SPI

Winbond 

3. PIN CONFIGURATION

W25P10, W25P20 AND W25P40

Figure 1. W25P10, W25P20 and W25P40 Pin Assignments, 8-pin SOIC 150-mil

4. PIN DESCRIPTION

PIN NO.

1

2

3

4

5

6

7

8

PIN NAME

/CS

DO

/WP

GND

DI

CLK

/HOLD

VCC

I/O

FUNCTION

I

Chip Select Input

O

Data Output

I

Write Protect Input

Ground

I

Data Input

I

Serial Clock Input

I

Hold Input

Power Supply

4.1 Package Types

The standard package for the W25P10/20/40 is an 8-pin plastic SOIC with 150-mil body (Winbond

package code SN) (NexFlash package code N). It also allows a package migration path to higher

density Serial Flash devices. The pinout for the package is shown in Figure 1. Package diagrams and

dimensions are illustrated at the end of this data sheet. Optional 8-contact MLP packages may be

available. Please contact Winbond for further MLP package information.

4.2 Chip Select (/CS)

The SPI Chip Select (/CS pin enables and disables device operation. When /CS is high the device is

deselected and the Serial Data Output (DO) pin is at high impedance. When deselected, the devices

power consumption will be at standby levels unless an internal erase, program or status register cycle

is in progress. When /CS is brought low the device will be selected, power consumption will increase

to active levels and instructions can be written to and data read from the device. After power-up, /CS

must transition from high to low before a new instruction will be accepted. The /CS input must track

Publication Release Date: November 28, 2005

-5-

Revision M

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