W24L257S70LL View Datasheet(PDF) - Winbond
Part Name
Description
Manufacturer
W24L257S70LL Datasheet PDF : 11 Pages
| |||
W24L257
BONDING PAD DIAGRAM
6
A4
7
A3
54
A5 A6
3 2 1 30 29 28 27 26 25 24
A7 A12 A14 VDD VDD WEB A13 A8 A9 A11
AC5394 23
OEB
Y
X
8
22
A2
A10
9 10 11 12 13 14 15 16 17 18 19 20 21
A1 A0 I/O0 I/O1 I/O2 VSS VSS I/O3 I/O4 I/O5 I/O6 I/O7 CSB
PAD NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
X
-232.25
-351.70
-471.15
-590.60
-710.05
-829.50
-992.79
-992.79
-857.86
-738.41
-594.84
-451.06
-310.67
-171.78
24.45
151.80
298.07
443.28
588.20
732.84
871.11
992.75
992.75
810.09
690.64
571.19
451.74
332.29
120.25
-93.23
Y
1445.22
1445.22
1445.22
1445.22
1445.22
1445.22
1362.24
-1306.11
-1452.79
-1452.79
-1414.13
-1414.13
-1414.13
-1405.28
-1405.28
-1414.13
-1414.13
-1414.13
-1414.13
-1414.13
-1452.79
-1312.15
1373.67
1445.22
1445.22
1445.22
1445.22
1445.22
1444.65
1444.65
Note: For bare chip form (C.O.B.) applications, the substrate must be connected to VDD or left floating in the PCB layout.
Publication Release Date: December 2000
-9-
Revision A3
|
|
Share Link: 