VSC834 View Datasheet(PDF) - Vitesse Semiconductor

Part Name

Description

Manufacturer

VSC834

2.5Gb/s 17x17 Crosspoint Switch with Input Signal Activity (ISA) Monitoring

Vitesse Semiconductor 

VITESSE

SEMICONDUCTOR CORPORATION

2.5Gb/s 17x17 Crosspoint Switch

with Input Signal Activity (ISA) Monitoring

Datasheet

VSC834

Package Pin Descriptions

The VSC834 is packaged in a 27x27mm 256 pin ball grid array package. The 256 BGA package is ther-

mally enhanced and carries the high-speed signals over controlled impedance lines from the solder ball to the

circuit die. The following sections describe the pinout and mechanical details of the VSC834.

Figure 5: Functional Pinout Floorplan

A0 A2 A4

Programming

Interface

A16

I/P LOA and Termination

Control Logic

Y0

17:1 Switch Slice Pair

17:1 Switch Slice Pair

Y1

Y2

17:1 Switch Slice Pair

17:1 Switch Slice Pair

Y3

17:1 Switch Slice Pair

Y15

Y16

17:1 Switch Slice Pair

I/P LOA and Termination

Control Logic

A1 A3 A5

A15

Programming

Interface

Page 10

© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012

Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com

Internet: www.vitesse.com

G52247-0, Rev 4.2

02/09/01

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