UPD168110 View Datasheet(PDF) - NEC => Renesas Technology

Part Name

Description

Manufacturer

UPD168110

MICROSTEP DRIVER FOR DRIVING CAMERA LENS

NEC => Renesas Technology 

µPD168110

RECOMMENDED SOLDERING CONDITIONS

The µPD168110 should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Recommended Soldering Conditions for Surface Mounting Type

µPD168110MA-6A5 24pin TSSOP

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or

IR60-00-3

higher), Count: Three times or less, Exposure limit: None, Flux: Rosin flux with

low chlorine (0.2 Wt% or below) recommended

Caution Do not use different soldering methods together (except for partial heating).

Data Sheet S15840EJ2V0DS

17

Share Link: