TSC80C31-40AGB/883 View Datasheet(PDF) - Temic Semiconductors
Part Name
Description
Manufacturer
TSC80C31-40AGB/883 Datasheet PDF : 19 Pages
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Ordering Information
TSC
80C51
XXX
–20
TSC80C31/80C51
C
B
R
Part Number
80C31: External ROM
80C51: 4Kx8 Mask ROM
80C51C: Secret ROM version
80C51T: Secret Tag version
–12: 12 MHz version
–16: 16 MHz version
–20: 20 MHz version
–25: 25 MHz version
–30: 30 MHz version
–36: 36 MHz version
–40: 40 MHz version
–44: 44 MHz version
–L16: Low Power
(VCC: 2.7–5.5V,
Freq.: 0–16 MHz)
–L20: Low Power
(VCC: 2.7–5.5V,
Freq.: 0–20 MHz)
Packaging
A: PDIL 40
B: PLCC 44
C: PQFP 44 (fp 13.9mm)
D: PQFP 44 (fp 12.3mm)
E: VQFP 44 (1.4mm)
F: TQFP 44 (1mm)
G: CDIL 40 (.6)
H: LCC 44
I: CQPJ 44
Die form:
W: Wafer
X: Dice Form
Y: Wafer on Ring
Blank: Standard
/883: MIL 883
Compliant
P883: MIL 883
Compliant
with
PIND test.
Customer ROM Code
(Not used for external ROM Device)
TEMIC Semiconductor
Microcontroller Product Line
Temperature Range
C : Commercial 0° to 70°C
I : Industrial –40° to 85°C
A : Automotive –40° to 125°C
M : Military –55° to 125°C
Conditioning
R : Tape & Reel
D : Dry Pack
B : Tape & Reel and
Dry Pack
Examples :
Mask ROM version XXX, PDIL 40, 20 MHz version, Commercial Temperature Range . TSC80C31/80C51XXX–20CA
(1) Ceramic of multi–layer packages: contact TEMIC Sales office
Product Marking :
For PDIL 40, PLCC 44 & QFP 44 Packages
TEMIC
Customer P/N
Temic P/N
© Intel 80, 82
YYWW Lot Number
MATRA MHS
19
Rev. E (14 Jan.97)
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