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TYN1225 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
TYN1225
ST-Microelectronics
STMicroelectronics ST-Microelectronics
TYN1225 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Characteristics
TN2540, TXN625, TYN625, TYN825, TYN1225
Figure 5.
Relative variation of thermal
impedance versus pulse duration
(TO-220AB ins)
K=[Zth/Rth]
1,0E+00
Figure 6.
Relative variation of gate trigger,
holding, and latching currents
versus junction temperature
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
2.5
1,0E-01
Zth(j-c)
Zth(j-a)
1,0E-02
1,0E-03
1,0E-02
1,0E-01
tp(s)
1,0E+00 1,0E+01 1,0E+02 1,0E+03
2.0
1.5
IGT
1.0
IH & IL
0.5
Tj(°C)
0.0
-40 -20
0
20
40
60
80 100 120 140
Figure 7.
Surge peak on-state current versus Figure 8.
number of cycles
Non-repetitive surge peak on-state
current, and corresponding values
of I2t
ITSM(A)
350
300
250
200
150
100
50
Repetitive
TC=83°C
0
1
Non repetitive
Tj initial=25 °C
tp=10ms
One cycle
ITSM(A), I2t (A2s)
2000
1000
dI/dt limitation
Tj initial = 25°C
ITSM
I2t
Number of cycles
10
100
1000
100
0.01
Sinusoidal pulse width tp(ms)
0.10
1.00
10.00
Figure 9.
On-state characteristics (maximum Figure 10. Thermal resistance junction to
values)
ambient versus copper surface
under tab (D2PAK)
ITM(A)
1000
100
Rth(j-a)(°C/W)
80
70
60
50
Epoxy printed circuit board FR4,
copper thickness = 35 µm
40
30
10
20
1
VTM(V)
Tj max :
Vto = 0.77V
10
Rd = 14m˜
0
S(cm²)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0
4
8 12 16 20 24 28 32 36 40
4/10
Doc ID 7478 Rev 8
 

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