TLP2166A(TP,F) View Datasheet(PDF) - Toshiba

Part Name

Description

Manufacturer

TLP2166A(TP,F)

TOSHIBA PHOTOCOUPLER GaAℓAs Ired & PHOTO-IC

Toshiba 

TLP2166A

Precautions Of Surface Mounting Type Photocoupler Soldering & General Storage

(1) Precautions for Soldering

1) When Using Soldering Reflow

z An example of a temperature profile when Sn-Pb eutectic solder is used:

z An example of a temperature profile when lead(Pb)-free solder is used:

z Reflow soldering must be performed once or twice.

z The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)

z Apply preheating of 150 deg.C for 60 to 120 seconds.

z Mounting condition of 260 deg.C or less within 10 seconds is recommended.

z Flow soldering must be performed once

3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)

z Complete soldering within 10 seconds for lead temperature not exceeding 260 deg.C or within 3 seconds

not exceeding 350 deg.C.

z Heating by soldering iron must be only once per 1 lead

9

2008-11-27

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