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TLP2531 View Datasheet(PDF) - Toshiba

Part Name
Description
Manufacturer
TLP2531 Datasheet PDF : 0 Pages
Absolute Maximum Ratings
TLP2530,TLP2531
Characteristic
Symbol
Rating
Unit
Forward current(each channel)
Pulse forward current
(Each Channel)
Total pulse forward current
(each channel)
Reverse voltage(each channel)
Diode power dissipation
(each channel)
Output current(each channel)
Peak output current
(each channel)
Supply voltage
Output voltage(each channel)
Output power dissipation
(each channel)
Operating temperature range
Storage temperature range
Lead solder temperature(10s)**
Isolation voltage
(AC, 1min., R.H.60%)
(Note 1)
(Note 2)
(Note 3)
(Note 4)
(Note 5)
(Note 7)
IF
IFP
IFPT
VR
PD
IO
IOP
VCC
VO
PO
Topr
Tstg
Tsol
BVS
25
50
1
5
45
8
16
0.5~15
0.5~15
35
55~100
55~125
260
2500
mA
mA
A
V
mW
mA
mA
V
V
mW
°C
°C
°C
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(Note 1) Derate 0.8mA above 70°C.
(Note 2) 50% duty cycle, 1ms pulse width. Derate 1.6mA / °C above 70°C.
(Note 3) Pulse width 1μs, 300pps.
(Note 4) Derate 0.9mW / °C above 70°C.
(Note 5) Derate 1mW / °C above 70°C.
**2mm below seating plane.
Recommended Operating Conditions
Characteristic
Symbol
Min.
Typ.
Max. Unit
Supply voltage
Forward current, each channel
Operating temperature
VCC
IF
Topr
0
16
25
12
V
25
mA
85
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
2
2007-10-01
 

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