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TLP181 View Datasheet(PDF) - Toshiba

Part Name
Description
Manufacturer
TLP181 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Absolute Maximum Ratings (Ta = 25°C)
TLP181
Characteristic
Symbol
Rating
Unit
Forward current
Forward current detating
Pulse forward current
(100μs pulse, 100pps)
Reverse voltage
Junction temperature
Collectoremitter voltage
Emittercollector voltage
Collector current
Collector power dissipation
(1 Circuit)
Collector power dissipation
derating (1 Circuit Ta 25°C)
Junction temperature
Storage temperature range
Operating temperature range
Lead soldering temperature
Total package power dissipation
Total package power dissipation
derating (Ta 25°C)
Isolation voltage
(AC, 1min., R.H. 60%)
(Note 1)
IF
ΔIF / °C
IFP
VR
Tj
VCEO
VECO
IC
PC
ΔPC / °C
Tj
Tstg
Topr
Tsol
PT
ΔPT / °C
BVS
50
1.4 (Ta 89°C)
1
5
125
80
7
50
150
1.5
125
55 to 125
55 to 110
260 (10s)
200
2.0
3750
mA
mA / °C
A
V
°C
V
V
mA
mW
mW / °C
°C
°C
°C
°C
mW
mW / °C
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(Note 1) Device considered a twoterminal device: Pin1, 3 shorted together and pins 4, 6 shorted together
Recommended Operating Conditions
Characteristic
Symbol
Min Typ. Max Unit
Supply voltage
Forward current
Collector current
VCC
IF
IC
5
48
V
16
20
mA
1
10
mA
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
3
2009-11-12
 

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