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Y59212 View Datasheet(PDF) - Texas Instruments

Part NameDescriptionManufacturer
Y59212 8-Bit Open-Collector Sink Driver with Latch TI
Texas Instruments TI
Y59212 Datasheet PDF : 19 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
TLC59212
SCLS713A – MARCH 2009 – REVISED JULY 2015
6 Specifications
www.ti.com
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
VCC
Supply voltage
D
Input voltage
VO
Output voltage
IO
Output current
IIK
Input clamp current
TA
Operating free-air temperature
Tstg
Storage temperature
D, CLK, CLR
H output
1 bit for output low
VI < 0 V
MIN
MAX
UNIT
–0.5
7
V
–0.5
7
V
–0.5
30
V
40
mA
–20
mA
–40
85
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-
C101 (2)
VALUE
±2000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
VCC = 4.5 V to 5.5 V. Over operating free-air temperature range (unless otherwise noted)
MIN
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
VO
Output voltage
IO
Output current, Duty cycle < 100%
TA
Operating free-air temperature
4.5
VCC × 0.7
0
0
0
–40
MAX
5.5
VCC
VCC × 0.3
24
40
85
UNIT
V
V
V
V
mA
°C
6.4 Thermal Information
THERMAL METRIC(1)
TLC59212
N (PDIP) PW (TSSOP)
UNIT
20 PINS
20 PINS
RθJA
RθJC(top)
RθJB
ψJT
ψJB
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
55.8
96.0
°C/W
47.4
29.8
°C/W
36.8
47.3
°C/W
24.3
1.8
°C/W
36.6
46.7
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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