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Y2274A View Datasheet(PDF) - Texas Instruments

Part NameDescriptionManufacturer
Y2274A Advanced LinCMOSE RAIL-TO-RAIL OPERATIONAL AMPLIFIERS TI
Texas Instruments TI
Y2274A Datasheet PDF : 76 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
TLC227x, TLC227xA
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Advanced LinCMOSRAILĆTOĆRAIL
OPERATIONAL AMPLIFIERS
SLOS190G − FEBRUARY 1997 − REVISED MAY 2004
TLC2272 AVAILABLE OPTIONS
TA
0°C to 70°C
VIOmax
At 25°C
SMALL
OUTLINE†
(D)
950 µV TLC2272ACD
2.5 mV TLC2272CD
CERAMIC
LCC
(FK)
PACKAGED DEVICES
CERAMIC
DIP
(JG)
PLASTIC DIP
(P)
TSSOP‡
(PW)
TLC2272ACP TLC2272ACPW
TLC2272CP TLC2272CPW
CERAMIC
FLAT PACK
(U)
950 µV TLC2272AID
2.5 mV TLC2272ID
−40°C to 125°C
950 µV TLC2272AQD
2.5 mV TLC2272QD
TLC2272AIP
TLC2272IP TLC2272IPW
TLC2272AQPW
TLC2272QPW
−55°C to 125°C
950 µV
2.5 mV
TLC2272AMD TLC2272AMFK TLC2272AMJG TLC2272AMP
TLC2272MD TLC2272MFK TLC2272MJG TLC2272MP
The D packages are available taped and reeled. Add R suffix to the device type (e.g., TLC2272CDR).
The PW package is available taped and reeled. Add R suffix to the device type (e.g., TLC2272PWR).
§ Chips are tested at 25°C.
TLC2272AMU
TLC2272MU
TLC2274 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
SMALL
OUTLINE†
(D)
CERAMIC
LCC
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
TSSOP‡
(PW)
CERAMIC
FLAT PACK
(W)
0°C to 70°C
950 µV TLC2274ACD
2.5 mV TLC2274CD
TLC2274ACN TLC2274ACPW
TLC2274CN TLC2274CPW
950 µV TLC2274AID
2.5 mV TLC2274ID
−40°C to 125°C
950 µV TLC2274AQD
2.5 mV TLC2274QD
TLC2274AIN TLC2274AIPW
TLC2274IN TLC2274IPW
−55°C to 125°C
950 µV
2.5 mV
TLC2274AMD TLC2274AMFK TLC2274AMJ
TLC2274MD TLC2274MFK TLC2274MJ
TLC2274AMN
TLC2274MN
TLC2274AMW
TLC2274MW
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2274CDR).
The PW package is available taped and reeled.
§ Chips are tested at 25°C.
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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