CD4060BMS View Datasheet(PDF) - Harris Semiconductor
Part Name
Description
Manufacturer
CD4060BMS Datasheet PDF : 9 Pages
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Test Circuits (Continued)
CD4060BMS
11
10
9
C1
RC
RS
C2
NOTE:
CXTAL = C1 + C2 + CSTRAY
RC = Broader frequency
response
RS = Current limiting
FIGURE 11. TYPICAL CRYSTAL CIRCUIT
Chip Dimensions and Pad Layout
Dimension in parenthesis are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10-3 inch).
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
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notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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