80023 View Datasheet(PDF) - Philips Electronics

Part Name

Description

Manufacturer

80023

IC card interface

Philips Electronics 

Philips Semiconductors

IC card interface

Product specification

TDA8002

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); note 1.

SYMBOL

VDD

Vi(CMOS)

Vi(card)

Ves

Tstg

Ptot

Tamb

Tj

PARAMETER

CONDITIONS

supply voltage

voltage on CMOS pins

XTAL1, XTAL2, ALARM, ALARM,

MODE, RSTIN, CLKSEL, AUX2UC,

AUX1UC, CLKDIV1, CLKDIV2,

CLKOUT, STROBE, CMDVCC and

OFF

voltage on card contact pins

I/O, AUX2, PRES, PRES, AUX1,

CLK, RST and VCC

electrostatic handling

on pins I/O, RST, VCC, CLK, AUX1,

AUX2, PRES and PRES

on all other pins

storage temperature

continuous total power dissipation

TDA8002T

TDA8002G

operating ambient temperature

Tamb = −25 to +85 °C

Tamb = −25 to +85 °C

junction temperature

MIN.

−0.3

MAX.

+6.5

UNIT

V

−0.3

+6.5

V

−0.3

+6.5

V

−6

+6

kV

−2

+2

kV

−55

+125

°C

−

0.56

W

−

0.46

W

−25

+85

°C

−

150

°C

Note

1. Stress beyond these levels may cause permanent damage to the device. This is a stress rating only and functional

operation of the device under this condition is not implied.

HANDLING

Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.

Method 3015 (HBM 1500 Ω, 100 pF) 3 positive pulses and 3 negative pulses on each pin referenced to ground.

THERMAL CHARACTERISTICS

SYMBOL

Rth(j-a)

PARAMETER

thermal resistance from junction to ambient in free air

SOT136-1

SOT401-1

VALUE

70

91

UNIT

K/W

K/W

1997 Nov 04

14

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