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TC1263-5.0VOA View Datasheet(PDF) - Microchip Technology

Part NameTC1263-5.0VOA Microchip
Microchip Technology Microchip
Description500 mA, Fixed-Output, CMOS LDO with Shutdown
TC1263-5.0VOA Datasheet PDF : 18 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
TC1263
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.0V, (Note 1), IL = 100 µA, CL = 3.3 µF,
SHDN > VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
SHDN Input
SHDN Input High Threshold
SHDN Input Low Threshold
ERROR Output (SOIC Only)
VIH
45
%VIN
VIL
15
%VIN
Minimum Operating Voltage
VMIN
1.0
V
Output Logic Low Voltage
VOL
400
mV 1 mA Flows to ERROR
ERROR Threshold Voltage
VTH
0.95 x VR
V
ERROR Positive Hysteresis
VHYS
50
mV
Note 1:
2:
3:
4:
5:
6:
7:
VR is the regulator output voltage setting.
The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX.
TCVOUT = ---V----O----U---T---M----A---V-X---O---U---V-T---O---U----T---TM----I--N------------1---0---6-
Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value measured at a 1.0V differential.
Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for
more details.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.0V, IL = 100 µA, CL = 3.3 µF,
SHDN > VIH, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
TA
-40
+125
°C Note 1
TJ
-40
+125
°C
TA
-65
+150
°C
Thermal Resistance, 5L-DDPAK
JA
57
°C/W
Thermal Resistance, 5L-TO-220
JA
71
°C/W
Thermal Resistance, 8L-SOIC
JA
163
°C/W
Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125°C).
2002-2012 Microchip Technology Inc.
DS21374D-page 3
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