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TC1263-2.5VAT View Datasheet(PDF) - Microchip Technology

Part NameTC1263-2.5VAT Microchip
Microchip Technology Microchip
Description500 mA, Fixed-Output, CMOS LDO with Shutdown
TC1263-2.5VAT Datasheet PDF : 18 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
TC1263
5-Lead Plastic (ET) (DDPAK)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
L3
E1
D2
D
D1
1
b
e
TOP VIEW
A
θ
A1
c
BOTTOM VIEW
L
θ1
(5X)
c2
Units
Dimension Limits
Number of Pins
Pitch
e
Overall Height
A
Standoff §
A1
Overall Width
E
Exposed Pad Width
E1
Molded Package Length
D
Overall Length
D1
Exposed Pad Length
D2
Lead Thickness
c
Pad Thickness
c2
Lead Width
b
Foot Length
L
Pad Length
L3
Foot Angle
θ
Mold Draft Angle
θ1
MIN
.170
.000
.385
.330
.549
.014
.045
.026
.068
.045
--
INCHES*
NOM
5
.067 BSC
.177
.005
.398
.256 REF
.350
.577
.303 REF
.020
--
.032
.089
--
--
--
MAX
.183
.010
.410
.370
.605
.026
.055
.037
.110
.067
MILLIMETERS
MIN
NOM
5
1.70 BSC
4.32
4.50
0.00
0.13
9.78
10.11
6.50 REF
8.38
8.89
13.94
14.66
7.75 REF
0.36
0.51
1.14
--
0.66
0.81
1.73
2.26
1.14
--
--
--
--
*Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC equivalent: TO-252
Drawing No. C04-012
MAX
4.65
0.25
10.41
9.40
15.37
0.66
1.40
0.94
2.79
1.70
DS21374D-page 10
2002-2012 Microchip Technology Inc.
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