GENERAL INFORMATION
SY Series
1. ROHS Compliance
• All relays produced by Fujitsu Components are compliant with RoHS directive 2011/65/EU including amend-
ments.
• Use of Cadmium in electrical contacts is exempted as per Annex III of the RoHS directive 2001/65/EU.
Please consider expiry date of exemption. Relays with Cadmium containing contacts are not to be used for
new designs.
• All relays are lead-free. Please refer to Lead-Free Status Info for older date codes at:
http://www.fujitsu.com/downloads/MICRO/fcai/relays/lead-free-letter.pdf
• Characteristic data is not guaranteed values, but measured values of samples from production line.
2. Recommended lead free solder condition
• Lead free solder plating on relay terminals is Sn-3.0Ag-0.5Cu, unless otherwise specified. This material has
been verified to be compatible with PbSn assembly process.
• Recommended solder for assembly: Sn-3.0Ag-0.5Cu.
Flow Solder Condition:
Pre-Heating: maximum 120˚C
within 90 sec.
Soldering:
dip within 5 sec. at
255˚C ± 5˚C solder bath
Relay must be cooled by air immediately
after soldering
Solder by Soldering Iron:
Soldering Iron: 30-60W
Temperature: maximum 340-360˚C
Duration:
maximum 3 sec.
We highly recommend that you confirm your actual solder conditions
3. Moisture Sensitivity
• Moisture Sensitivity Level is not applicable to electromechanical relays, unless otherwise indicated.
4. Tin Whiskers
• Dipped SnAgCu solder is known as presenting a low risk to tin whisker development. No considerable
length whisker was found by our in house test.
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