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STU11NM60ND View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
STU11NM60ND Datasheet PDF : 19 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
STD/F/I/P/U11NM60ND
1
Electrical ratings
Electrical ratings
Table 2. Absolute maximum ratings
Symbol
Parameter
Value
DPAK/I²PAK,
TO-220/IPAK
TO-220FP
VDS Drain-source voltage (VGS=0)
600
VGS Gate-source voltage
± 25
ID Drain current (continuous) at TC = 25°C
10
10 (1)
ID Drain current (continuous) at TC = 100°C
6.3
6.3(1)
IDM (2) Drain current (pulsed)
40
40 (1)
PTOT Total dissipation at TC = 25°C
90
25
dv/dt (3) Peak diode recovery voltage slope
40
VISO
Tstg
Insulation withstand voltage (RMS) from all
three leads to external heat sink
(t=1s;TC=25°C)
Storage temperature
2500
-55 to 150
Tj Max. operating junction temperature
150
1. Limited only by maximum temperature allowed
2. Pulse width limited by safe operating area
3. ISD 10 A, di/dt 400 A/µs, VDD = 80% V(BR)DSS, peak VDS V(BR)DSS
Unit
V
V
A
A
A
W
V/ns
V
°C
°C
Table 3. Thermal data
Symbol
Parameter
Value
Unit
TO-220 I²PAK DPAK IPAK TO-220FP
Rthj-case
Thermal resistance junction-case
max
Rthj-amb Thermal resistance junction-amb max
Rthj-pcb(1) Thermal resistance junction-pcb max
Tl
Maximum lead temperature for
soldering purposes
1.38
5
°C/W
62.5
100 62.5 °C/W
50
°C/W
300
300
°C
1. When mounted on 1inch² FR-4 board, 2 oz Cu
Doc ID 14625 Rev 2
3/19
 

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