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ST72321BXXX-AUTO View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
ST72321BXXX-AUTO Datasheet PDF : 247 Pages
First Prev 21 22 23 24 25 26 27 28 29 30 Next Last
Introduction
ST72321Bxxx-Auto
– added Note 3
13. Table 116: OSCRANGE selection for typical resonators on page 201:
– added title
– removed footnote detailing SMD- and LEAD-devices
14. Table 121: EMS test results on page 205:
– removed LQFP32 from conditions
– added Note 1
15. Table 122: EMI emissions on page 205:
– removed footnote 2
– added 32/48/60 Kbyte Flash/LQFP64 configuration
– added 48/60 Kbyte ROM/LQFP44 configuration
– added 32/48 Kbyte ROM/LQFP64 configuration
– changed values for 60 Kbyte ROM devices
16. Section 19.7.3: Absolute maximum ratings (electrical sensitivity) on page 206:
Removed text concerning dynamic latch-up (DLU)
17. Electrostatic discharge (ESD) on page 206: Replaced “JESD22-A114A/A115A
standard” with “AEC-Q100-002/-003/-011 standard” in last sentence
18. Table 123: ESD absolute maximum ratings on page 206:
– added AEC-Q100 standards to conditions
– added ‘Class’ column
– added CDM
19. Static latch-up (LU) on page 206:
– updated LU content
– deleted DLU content
20. Table 124: Electrical sensitivities on page 206:
– updated LU conditions and class
– removed DLU row
21. Table 125: I/O port pin general characteristics on page 207:
– replaced symbol for input leakage current IL with Ilkg
– modified Note 4
– Added Note 5
22. Table 136: 64-pin (14x14) low profile quad flat package mechanical data on page 224:
Changed dimensions in mm from 2 to 3 decimal digits and changed dimensions in
inches from 3 to 4 decimal digits
23. Table 137: 64-pin (10x10) low profile quad flat package mechanical data on page 225:
Changed dimensions in mm from 2 to 3 decimal digits and changed dimensions in
inches from 3 to 4 decimal digits
24. Table 138: 44-pin (10x10) low profile quad flat package mechanical data on page 226:
Changed dimensions in mm from 2 to 3 decimal digits and changed dimensions in
inches from 3 to 4 decimal digits
25. Added Section 20.3.1: Compatibility on page 227
26. Chapter 21: Device configuration and ordering information on page 228: Reorganized
subsections and made minor text editing changes
27. Table 139: Thermal characteristics on page 227:
22/247
 

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