NBSG16
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
VEE
VI
VINPP
Positive Power Supply
Negative Power Supply
Positive Input
Negative Input
Differential Input Voltage
|D − D|
VEE = 0 V
VCC = 0 V
VEE = 0 V
VCC = 0 V
VCC − VEE w
VCC − VEE <
2.8 V
2.8 V
VI VCC
VI VEE
3.6
V
−3.6
V
3.6
V
−3.6
V
2.8
V
|VCC − VEE|
V
Iout
Output Current
Continuous
Surge
25
mA
50
mA
IBB
VBB Sink/Source
IMM
VMM Sink/Source
TA
Operating Temperature Range
Tstg
Storage Temperature Range
qJA
Thermal Resistance (Junction−to−Ambient) 0 LFPM
(Note 2)
500 LFPM
0 LFPM
500 LFPM
16 FCBGA
16 FCBGA
16 QFN
16 QFN
1
1
−40 to +85
−65 to +150
108
86
41.6
35.2
mA
mA
°C
°C
°C/W
°C/W
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
1S2P (Note 2)
2S2P (Note 3)
16 FCBGA
16 QFN
5
°C/W
4.0
°C/W
Tsol
Wave Solder
Pb
Pb−Free
225
°C
225
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. JEDEC standard multilayer board − 1S2P (1 signal, 2 power)
3. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.
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