NBSG14
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
VEE
VI
VINPP
Positive Power Supply
Negative Power Supply
Positive Input
Negative Input
Differential Input Voltage |CLK−CLK|
IIN
Input Current Through RT (50 W Resistor)
VEE = 0 V
VCC = 0 V
VEE = 0 V
VCC = 0 V
VCC − VEE w 2.8 V
VCC − VEE < 2.8 V
Static
Surge
VI v VCC
VI w VEE
3.6
V
−3.6
V
3.6
V
−3.6
V
2.8
V
|VCC−VEE|
45
mA
80
mA
IOUT
Output Current
Continuous
Surge
25
mA
50
mA
TA
Operating Temperature Range
16 FCBGA
16 QFN
−40 to +70
°C
−40 to +85
Tstg
Storage Temperature Range
qJA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
(Note 2)
500 lfpm
0 lfpm
500 lfpm
16 FCBGA
16 FCBGA
16 QFN
16 QFN
−65 to +150
108
86
41.6
35.2
°C
°C/W
°C/W
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
2S2P (Note 2)
2S2P (Note 3)
16 FCBGA
16 QFN
5
°C/W
4.0
°C/W
Tsol
Wave Solder
Pb
Pb−Free
225
°C
225
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
2. JEDEC standard 51−6, multilayer board − 2S2P (2 signal, 2 power).
3. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.
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