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NB3N5573DTG View Datasheet(PDF) - ON Semiconductor

Part Name
Description
Manufacturer
NB3N5573DTG
ON-Semiconductor
ON Semiconductor ON-Semiconductor
NB3N5573DTG Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
NB3N5573
PACKAGE DIMENSIONS
TSSOP-16
CASE 948F-01
ISSUE B
0.15 (0.006) T U S
16
2X L/2
L
PIN 1
IDENT.
1
0.15 (0.006) T U S
C
0.10 (0.004)
-T- SEATING
PLANE
D
16X K REF
0.10 (0.004) M T U S V S
9
J1
B
-U- J
N
8
K
ÇÇÉÉÇÇÉÉK1 ÇÇÉÉ
SECTION N-N
0.25 (0.010)
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE -W-.
A
-V-
G
N
F
DETAIL E
H DETAIL E
-W-
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C ---
1.20 --- 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G
0.65 BSC
0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L
6.40 BSC
0.252 BSC
M 0_ 8_ 0_ 8_
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
 

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