NB6L16 View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
NB6L16 Datasheet PDF : 12 Pages
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NB6L16
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit-
s
VCC
PECL Mode Power Supply
VEE
NECL Mode Power Supply
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
Iout
Output Current
VEE = 0 V
VCC = 0 V
VEE = 0 V
VCC = 0 V
Continuous
Surge
VI v VCC
VI w VEE
3.6
V
−3.6
V
3.6
V
−3.6
V
25
mA
50
mA
VINPP
IBB
TA
Tstg
qJA
Differential Input Voltage
|D − D| VCC − VEE w 2.8 V
VCC − VEE t 2.8 V
VBB Sink/Source
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
SOIC−8
SOIC−8
2.8
|VCC − VEE|
± 0.5
−40 to +85
−65 to +150
190
130
V
mA
°C
°C
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
SOIC−8
qJA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
41 to 44
185
140
°C/W
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−8
Tsol
Wave Solder
Standard v 3 sec @ 248°C
Pb−Free v 3 sec @ 260°C
41 to 44
265
265
°C/W
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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