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MSA-1100-GP4 View Datasheet(PDF) - HP => Agilent Technologies

Part Name
Description
Manufacturer
MSA-1100-GP4
HP
HP => Agilent Technologies HP
MSA-1100-GP4 Datasheet PDF : 4 Pages
1 2 3 4
Typical Performance, TA = 25°C
(Unless otherwise noted, performance is for a MSA-1100 used with an external 200␣ pF capacitor. See bonding diagram.)
24
14
18
21
0.1 GHz
17
P1 dB
12
0.5 GHz
18
16
11..00 GGHHzz,
15
10
13
12
9
2.0 GHz
8
12
GP
11
6
Open Loop
3
Closed Loop
0
.02
.05 .1
.3 .5 1.0 2.0 3.0
FREQUENCY (GHz)
Figure 1. Typical Power Gain vs.
Frequency, Id = 60 mA.
22
6
4
20
40
60
80
Id (mA)
Figure 2. Power Gain vs. Current.
5
NF
4
3
–55 –25
+25
+85 +125
TEMPERATURE (°C)
Figure 3. Output Power at 1 dB Gain
Compression, Noise Figure and Power
Gain vs. Case Temperature,
f = 0.5 GHz, Id = 60 mA.
20
18
16
14
12
Id = 75 mA
Id = 60 mA
5.0
Id = 40 mA
4.0
3.0
0.1 0.2 0.3 0.5 1.0 2.0
FREQUENCY (GHz)
Figure 4. Output Power at 1 dB Gain
Compression and Noise Figure vs.
Frequency.
MSA-1100 Bonding Diagram
Input Trace
(backside
contact)
5
MSA
Die
2
14
3
Numbers refer to pin contacts listed on the Chip Outline.
Ground
Output
Trace
Capacitor
(200 pF typ)
Ground
MSA-1100 Chip Dimensions
(3) Output
(Backside Contact)
(4) Optional
Topside
3
Output*
5
(2) Ground
(1) Input
1
2
335 µm
13.2 mil
4
495 µm
19.5 mil
Bondpad
for Feedback
Capacitor
(5)
Unless otherwise specified, tolerances are ±13 µm / ±0.5 mils.
Chip thickness is 114 µm / 4.5 mil. Bond Pads are 41 µm / 1.6 mil
typical on each side.
* Output contact is made by die attaching the backside of the die.
6-453
 

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