FGB30N6S2D View Datasheet(PDF) -

TO-247

3 LEAD JEDEC STYLE TO-247 PLASTIC PACKAGE

E

ØR

D

A

Q

TERM. 4

ØS ØP

L1

L

b1

b2

c

b

1

2

3

e

J1

e1

3

2

1

BACK VIEW

INCHES

MILLIMETERS

SYMBOL

MIN

MAX

MIN

MAX

NOTES

A

0.180

0.190

4.58

4.82

-

b

0.046

0.051

1.17

1.29

2, 3

b1

0.060

0.070

1.53

1.77

1, 2

b2

0.095

0.105

2.42

2.66

1, 2

c

0.020

0.026

0.51

0.66

1, 2, 3

D

0.800

0.820

20.32

20.82

-

E

0.605

0.625

15.37

15.87

-

e

0.219 TYP

5.56 TYP

4

e1

0.438 BSC

11.12 BSC

4

J1

0.090

0.105

2.29

2.66

5

L

0.620

0.640

15.75

16.25

-

L1

0.145

0.155

3.69

3.93

1

ØP

0.138

0.144

3.51

3.65

-

Q

0.210

0.220

5.34

5.58

-

ØR

0.195

0.205

4.96

5.20

-

ØS

0.260

0.270

6.61

6.85

-

NOTES:

1. Lead dimension and finish uncontrolled in L1.

2. Lead dimension (without solder).

3. Add typically 0.002 inches (0.05mm) for solder coating.

4. Position of lead to be measured 0.250 inches (6.35mm) from bottom of di-

mension D.

5. Position of lead to be measured 0.100 inches (2.54mm) from bottom of di-

mension D.

6. Controlling dimension: Inch.

7. Revision 1 dated 1-93.

©2001 Fairchild Semiconductor Corporation

FGH30N6S2D / FGP30N6S2D / FGB30NS2D Rev. A

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