DatasheetQ Logo
Electronic component search and free download site.
Transistors,MosFET ,Diode,Integrated circuits

MMBD352WT1G View Datasheet(PDF) - ON Semiconductor

Part Name
Description
Manufacturer
MMBD352WT1G
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MMBD352WT1G Datasheet PDF : 3 Pages
1 2 3
MMBD352WT1G,
NSVMMBD352WT1G
Dual Schottky Barrier Diode
These devices are designed primarily for UHF mixer applications
but are suitable also for use in detector and ultrafast switching
circuits.
Features
Very Low Capacitance Less Than 1.0 pF @ 0 V
Low Forward Voltage 0.5 V (Typ) @ IF = 10 mA
AEC Qualified and PPAP Capable
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Continuous Reverse Voltage
VR
7.0
VCC
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR5 Board
PD
(Note 1)
TA = 25C
Derate above 25C
200
mW
1.6
mW/C
Thermal Resistance,
JunctiontoAmbient
RqJA
625
C/W
Total Device Dissipation Alumina
Substrate (Note 2)
TA = 25C
Derate above 25C
PD
300
mW
2.4
mW/C
Thermal Resistance,
JunctiontoAmbient
RqJA
C/W
417
Junction and Storage Temperature
TJ, Tstg 55 to +150
C
1. FR5 = 1.0  0.75  0.062 in.
2. Alumina = 0.4  0.3  0.024 in. 99.5% alumina.
http://onsemi.com
SOT323 (SC70)
CASE 419
STYLE 9
1
ANODE
3
CATHODE/ANODE
2
CATHODE
MARKING DIAGRAM
M5 MG
G
1
M5
= Specific Device Code
M
= Date Code
G
= PbFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package Shipping
MMBD352WT1G
SOT323
3,000 /
(PbFree) Tape & Reel
NSVMMBD352WT1G SOT323
3,000 /
(PbFree) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2011
1
November, 2011 Rev. 5
Publication Order Number:
MMBD352WT1/D
 

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]