MC7808BDTG View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
MC7808BDTG Datasheet PDF : 32 Pages
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MC7800, MC7800A, NCV7805
20
qJC = 5°C/W
16
qHS = 0°C/W
qJA = 65°C/W
TJ(max) = 150°C
12
qHS = 5°C/W
8.0
qHS = 15°C/W
4.0
No Heatsink
0−50 −25
0 25 50 75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Figure 12. Worst Case Power Dissipation versus
Ambient Temperature (Case 221A)
2.5
IO = 1.0 A
IO = 500 mA
2.0
IO = 200 mA
1.5 IO = 20 mA
1.0 IO = 0 mA
0.5
DVO = 2% of VO
− − − Extended Curve for MC78XXB
0
−75 −50 −25 0
25 50
75 100 125
TJ, JUNCTION TEMPERATURE (°C)
Figure 13. Input Output Differential as a Function
of Junction Temperature (MC78XXC, AC, B)
80
3.5
70
Free Air
PD(max) for TA = 50°C
3.0
Mounted
Vertically
60
50
Minimum
Size Pad
40
RqJA
2.0 oz. Copper 2.5
L
ÎÎÎÎ2.0
ÎÎÎÎ L
ÎÎÎÎÎÎÎÎ1.5
30
1.0
0
5.0
10
15
20
25
30
L, LENGTH OF COPPER (mm)
Figure 14. D2PAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
100
90
80
70
60
50
40
0
Free Air
Mounted
Vertically
Minimum
Size Pad
5.0
10
2.4
PD(max) for TA = 50°C
2.0
2.0 oz. Copper
L
1.6
ÎÎÎÎÎÎÎÎ L
1.2
ÎÎÎÎÎÎÎÎ0.8
0.4
RqJA
0
15
20
25
30
L, LENGTH OF COPPER (mm)
Figure 15. DPAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
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21
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