MC33030PG View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
MC33030PG Datasheet PDF : 17 Pages
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MC33030
ELECTRICAL CHARACTERISTICS (continued) (VCC = 14 V, TA = 25°C, unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max Unit
WINDOW DETECTOR
Input Hysteresis Voltage (V1 − V4, V2 − V3, Figure 18)
Input Dead Zone Range (V2 − V4, Figure 18)
Input Offset Voltage ( ⎢[V2 − VPin 2] − [VPin 2 − V4] ⎟ Figure 18)
Input Functional Common−Mode Range (Note 3)
Upper Threshold
Lower Threshold
Reference Input Self Centering Voltage
Pins 1 and 2 Open
VH
VIDZ
VIO
VIH
VIL
VRSC
25
35
45
mV
166
210
254
mV
−
25
−
mV
V
−
(VCC − 1.05)
−
−
0.24
−
−
(1/2 VCC)
−
V
Window Detector Propagation Delay
Comparator Input, Pin 3, to Drive Outputs
VID = 0.5 V, RL(DRV) = 390 W
tp(IN/DRV)
−
2.0
−
ms
OVERCURRENT MONITOR
Overcurrent Reference Resistor Voltage (Pin 15)
Delay Pin Source Current
VDLY = 0 V, ROC = 27 k, IDRV = 0 mA
Delay Pin Sink Current (ROC = 27 k, IDRV = 0 mA)
VDLY = 5.0 V
VDLY = 8.3 V
VDLY = 14 V
Delay Pin Voltage, Low State (IDLY = 0 mA)
Overcurrent Shutdown Threshold
VCC = 14 V
VCC = 8.0 V
Overcurrent Shutdown Propagation Delay
Delay Capacitor Input, Pin 16, to Drive Outputs, VID = 0.5 V
ROC
3.9
IDLY(source)
−
IDLY(sink)
−
−
−
VOL(DLY)
−
Vth(OC)
6.8
5.5
tp(DLY/DRV)
−
4.3
4.7
V
5.5
6.9
mA
mA
0.1
−
0.7
−
16.5
−
0.3
0.4
V
V
7.5
8.2
6.0
6.5
1.8
−
ms
POWER H−SWITCH
Drive−Output Saturation (− 40°C p TA p+ 85°C, Note 4)
V
High−State
(Isource = 100 mA) VOH(DRV) (VCC − 2) (VCC − 0.85)
−
Low−State
(Isink = 100 mA)
VOL(DRV)
−
0.12
1.0
Drive−Output Voltage Switching Time (CL = 15 pF)
Rise Time
Fall Time
ns
tr
−
200
−
tf
−
200
−
Brake Diode Forward Voltage Drop (IF = 200 mA, Note 4)
VF
−
1.04
2.5
V
TOTAL DEVICE
Standby Supply Current
ICC
−
14
25
mA
Overvoltage Shutdown Threshold
(− 40°C p TA p + 85°C)
Vth(OV)
16.5
18
20.5
V
Overvoltage Shutdown Hysteresis (Device “off” to “on”)
VH(OV)
0.3
0.6
1.0
V
Operating Voltage Lower Threshold
(− 40°C p TA p + 85°C)
VCC
−
7.5
8.0
V
3. The upper or lower hysteresis will be lost when operating the Input, Pin 3, close to the respective rail. Refer to Figure 4.
4. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient temperature as possible.
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