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M93C46-WDS7G View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
M93C46-WDS7G Datasheet PDF : 31 Pages
First Prev 21 22 23 24 25 26 27 28 29 30
M93C86, M93C76, M93C66, M93C56, M93C46
Figure 14. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Outline
D
E
A
A1
L3
ddd
e
b
L1
E2
L
D2
UFDFPN-01
Note: 1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be allowed to be connected to
any other voltage or signal line on the PCB, for example during the soldering process.
Table 26. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Data
Symbol
Typ.
mm
Min.
Max.
Typ.
inches
Min.
Max.
A
0.55
0.50
0.60
0.022
0.020
0.024
A1
0.00
0.05
0.000
0.002
b
0.25
0.20
0.30
0.010
0.008
0.012
D
2.00
0.079
D2
1.55
1.65
0.061
0.065
ddd
0.05
0.002
E
3.00
0.118
E2
0.15
0.25
0.006
0.010
e
0.50
–
–
0.020
–
–
L
0.45
0.40
0.50
0.018
0.016
0.020
L1
0.15
0.006
L3
0.30
0.012
N
8
8
25/31
 

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