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M48Z35AY-100PC1TR View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
M48Z35AY-100PC1TR
ST-Microelectronics
STMicroelectronics ST-Microelectronics
M48Z35AY-100PC1TR Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
M48Z35AY, M48Z35AV
Figure 2A. DIP Pin Connections
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
1
28
2
27
3
26
4
25
5
24
6
23
7 M48Z35AY 22
8 M48Z35AV 21
9
20
10
19
11
18
12
17
13
16
14
15
VCC
W
A13
A8
A9
A11
G
A10
E
DQ7
DQ6
DQ5
DQ4
DQ3
AI02782B
Figure 2B. SOIC Pin Connections
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
1
28
2
27
3
26
4
25
5
24
6
23
7 M48Z35AY 22
8 M48Z35AV 21
9
20
10
19
11
18
12
17
13
16
14
15
AI02783
VCC
W
A13
A8
A9
A11
G
A10
E
DQ7
DQ6
DQ5
DQ4
DQ3
Table 2. Absolute Maximum Ratings (1)
Symbol
Parameter
Value
Unit
TA
Ambient Operating Temperature Grade 1
Grade 6
0 to 70
–40 to 85
°C
TSTG
Storage Temperature (VCC Off) SNAPHAT
SOIC
–40 to 85
–55 to 125
°C
TSLD (2)
Lead Solder Temperature for 10 seconds
260
°C
VIO
Input or Output Voltages
–0.3 to 7
V
VCC
Supply Voltage
–0.3 to 7
V
IO
Output Current
20
mA
PD
Power Dissipation
1
W
Note: 1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other conditions above those indicated in the operational section
of this specification is not implied. Exposure to the absolute maximum rating conditions for extended periods of time may affect
reliability.
2. Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for longer than 30 seconds).
CAUTION: Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up mode.
CAUTION: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.
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