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M36W216 View Datasheet(PDF) - STMicroelectronics

Part NameDescriptionManufacturer
M36W216 16 Mbit 1Mb x16 / Boot Block Flash Memory and 2 Mbit 128Kb x16 SRAM / Multiple Memory Product ST-Microelectronics
STMicroelectronics ST-Microelectronics
M36W216 Datasheet PDF : 62 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
M36W216TI
M36W216BI
16 Mbit (1Mb x16, Boot Block) Flash Memory
and 2 Mbit (128Kb x16) SRAM, Multiple Memory Product
PRELIMINARY DATA
FEATURES SUMMARY
s MULTIPLE MEMORY PRODUCT
– 16 Mbit (1Mb x 16) Boot Block Flash Memory
– 2 Mbit (128Kb x 16) SRAM
s SUPPLY VOLTAGE
– VDDF = VDDS = 2.7V to 3.3V
– VDDQF = VDDS = 2.7V to 3.3V
– VPPF = 12V for Fast Program (optional)
s ACCESS TIME: 70ns, 85ns
s LOW POWER CONSUMPTION
s ELECTRONIC SIGNATURE
– Manufacturer Code: 20h
– Top Device Code, M36W216TI: 88CEh
– Bottom Device Code, M36W216BI: 88CFh
FLASH MEMORY
s MEMORY BLOCKS
– Parameter Blocks (Top or Bottom location)
– Main Blocks
s PROGRAMMING TIME
– 10µs typical
– Double Word Programming Option
s BLOCK LOCKING
– All blocks locked at Power up
– Any combination of blocks can be locked
– WPF for Block Lock-Down
s AUTOMATIC STAND-BY MODE
s PROGRAM and ERASE SUSPEND
s 100,000 PROGRAM/ERASE CYCLES per
BLOCK
s COMMON FLASH INTERFACE
– 64 bit Security Code
s SECURITY
– 64 bit user programmable OTP cells
– 64 bit unique device identifier
– One parameter block permanently lockable
SRAM
s 2 Mbit (128K x 16 bit)
s ACCESS TIME: 70ns
s LOW VDDS DATA RETENTION: 1.5V
s POWER DOWN FEATURES USING TWO
CHIP ENABLE INPUTS
Figure 1. Packages
FBGA
Stacked LFBGA66 (ZA)
12 x 8mm
November 2002
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
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