M24C16-F View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
M24C16-F Datasheet PDF : 39 Pages
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M24C16-W M24C16-R M24C16-F
Package mechanical data
Figure 14. UFDFPN8 (MLP8) – package outline (UFDFPN: Ultra thin Fine pitch
Dual Flat Package, No lead)
3LQ,'PDUNLQJ
Ğ
ď
>ϭ
>ϯ
WŝŶϭ
Ϯ
<
>
Ϯ
ĞĞĞ
ϭ
=:B0(H9
1. Drawing is not to scale.
2.
The
(not
central pad
connected)
(the area E2 by D2 in the
in the end application.
above
illustration)
must
be
either
connected
to
VSS
or
left
floating
Table 19. UFDFPN8 (MLP8) – package dimensions (UFDFPN: Ultra thin Fine pitch
Dual Flat Package, No lead)
Symbol
millimeters
Typ
Min
Max
inches(1)
Typ
Min
Max
A
A1
b
D
D2
E
E2
e
K
L
L1
L3
eee(2)
0.550
0.020
0.250
2.000
–
3.000
–
0.500
–
–
–
–
–
0.450
0.000
0.200
1.900
1.200
2.900
1.200
–
0.300
0.300
–
0.300
0.080
0.600
0.050
0.300
2.100
1.600
3.100
1.600
–
–
0.500
0.150
–
–
0.0217
0.0008
0.0098
0.0787
–
0.1181
–
0.0197
–
–
–
–
–
0.0177
0.0000
0.0079
0.0748
0.0472
0.1142
0.0472
–
0.0118
0.0118
–
0.0118
0.0031
0.0236
0.0020
0.0118
0.0827
0.0630
0.1220
0.0630
–
–
0.0197
0.0059
–
–
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
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