Stressing the device above the rating listed in the Absolute Maximum Ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 5. Absolute maximum ratings
Lead solder temperature for 10 seconds
–65 to +150
–0.6 to VCC + 0.6
VCC Supply voltage
–0.2 to 6.5
TJ(max) Maximum junction temperature
–55 to 130
Ambient operating temperature
–40 to 85
1. Reflow at peak temperature of 255°C to 260°C for < 30 seconds (total thermal budget not to exceed 180°C
for between 90 to 150 seconds).
2. Grade 7: STLM20DD7F and STLM20W87F
Grade 9: STLM20DD9F and STLM20W89F.